Method of manufacturing a device

ABSTRACT

Wirings  2 B 1  are formed by application of heat treatment after an ink jet system is used to discharge a conductive liquid L onto a provisional substrate  5  having a predetermined repellent property, bonding an insulating layer  4 B 1  to the wirings  2 B 1  with an adhesive material  3 B 1  therebetween, peeling and removing the provisional substrate  5,  and bonding and fixing the wirings  2 B 1  together with the insulating film  4 B 1  to a main substrate  1  by an adhesive material  3 B 1 .

BACKGROUND OF THE INVENTION

1. Technical Filed

The present invention relates to a method of manufacturing a device, adevice, a non-contact type card medium, and electronic equipment.

2. Related Art

As well known, the photolithographic method is generally used to formprinted-circuit boards incorporated into various electronic equipmentand wiring patterns in various semiconductor devices. Thephotolithographic method comprises using an etching processing torepeatedly leave only necessary portions on a film formed on a substrateand remove remaining portions to form various circuit elements andwiring patterns on the substrate. Such a photolithographic method usesthe etching processing to repeatedly remove many portions of the film,and so involves a disadvantage that a material for formation of a filmis wasted. As a method of overcoming such disadvantage, there has beenproposed a method of directly forming a wiring pattern in a paintingmanner by the use of an ink jet system to continuously discharge aconductive liquid sequentially and locally on a substrate.

However, the method of forming a wiring pattern with the use of the inkjet system involves the following problems. More specifically, since arepellent property is required of a substrate, on which a conductiveliquid is discharged, in forming a fine wiring pattern having a largefilm thickness, it is necessary to subject a surface of a substrate tosurface preparation for ensuring a repellent property as a pretreatment,and so such surface preparation makes a manufacturing process complex.Also, in order to impart a repellent property of a certain level tovarious kinds of substrates, it is necessary to search for conditions ofsurface preparation conforming to a material of an associated substrate,and to set conditions of surface preparation conforming to a substratematerial when an actual wiring pattern is formed. Also, some substratematerials cannot realize conditions of surface preparation for impartinga repellent property of a certain level, that is, some substratematerials make conditions of surface preparation very difficult.Further, while it has been proposed to use the ink jet system to form aninterlayer insulating film in the case of forming multilayer wirings, amanufacturing process is made complex because it is necessary to form awiring pattern by carrying out the surface preparation every time aninterlayer insulating film is formed.

Meanwhile, in the case where the ink jet system is used to form a wiringpattern, a conductive liquid discharged onto a substrate surface must beconverted into a conductive film with heat treatment, and so substratematerials are required to endure such heat treatment. For example, asubstrate made of plastics does not posses resistance to the heattreatment, so that it cannot be employed in a method of forming a wiringpattern with the ink jet system.

The invention has been provided in view of the above problems, and hasthe following objects.

To form a favorable wiring pattern irrespective of a quality of asubstrate material with the use of the ink jet system.

(2) To form a wiring pattern by the use of the ink jet system withoutperforming surface preparation for imparting a repellent property of acertain level.

(3) To simplify the steps of forming a multilayer wiring with the use ofthe ink jet system.

SUMMARY

To attain the objects, the invention adopts, as a first aspect relatingto a method of manufacturing a device, a configuration comprising thesteps of (a) forming first wirings on a provisional substrate, (b)mounting an insulating body on the first wirings to form a laminatedbody of the first wirings and the insulating body, (c) peeling off thelaminated body from the provisional substrate, and (d) mounting thelaminated body on a main substrate.

Also, in a second aspect relating to a method of manufacturing a device,there is adopted a configuration, in which in the step (a), before thefirst wirings are formed, a surface of the provisional substratepossesses a property permitting the first wirings and the provisionalsubstrate to peel off in the step (c).

In a third aspect relating to a method of manufacturing a device, thereis adopted a configuration, in which the property permitting peeling offcomprises a repellent property.

In a fourth aspect relating to a method of manufacturing a device, thereis adopted a configuration, in which in the step (a), the first wiringsare formed by means of a droplet discharge method.

In a fifth aspect relating to a method of manufacturing a device, thereis adopted a configuration, in which the step (b) comprises bonding aninsulating film to the first wirings.

In a sixth aspect relating to a method of manufacturing a device, thereis adopted a configuration, in which in the step (d), second wirings areinitially formed on the main substrate and the laminated body is mountedon the main substrate in a manner to provide conduction between thesecond wirings and the first wirings.

In a seventh aspect relating to a method of manufacturing a device,there is adopted a configuration, in which in the step (d), circuitterminals are first formed on the main substrate and the laminated bodyis mounted on the main substrate in a manner to provide conductionbetween the circuit terminals and the first wirings.

In a eighth aspect relating to a method of manufacturing a device, thereis adopted a configuration of the method of manufacturing a device,wherein openings are formed on the insulating body to expose at least apart of the first wirings.

In a ninth aspect relating to a method of manufacturing a device, thereis adopted a configuration, in which the openings are first formed onthe insulating body prior to the step (b).

In a tenth aspect relating to a method of manufacturing a device, thereis adopted a configuration further comprising, after the step (d), astep (e) of forming a conductive layer on the openings.

In an eleventh aspect relating to a method of manufacturing a device,there is adopted a configuration, in which the step (e) is effected bymeans of a droplet discharge method.

In a twelfth aspect relating to a method of manufacturing a device,there is adopted a configuration, in which the droplets comprise liquidbodies containing fine metallic particles.

In a thirteenth aspect relating to a method of manufacturing a device,there is adopted a configuration, in which multilayer wirings are formedby forming at least one or more new laminated bodies formed in the samestep as that, in which the laminated body is formed, on the laminatedbody.

Further, the invention adopts, in aspects relating to a device, aconfiguration, in which the device is manufactured according to themethod of manufacturing a device described above.

Also, the invention adopts, in aspects relating to a non-contact typecard medium, a configuration, in which an antenna circuit ismanufactured according to the method of manufacturing a device describedabove.

Also, the invention adopts an aspect of configuring electronic equipmentby means of the aspects relating to a device described above.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross sectional view showing part of a multilayer wiringpattern according to an embodiment of the invention.

FIG. 2 is a cross sectional view showing a first step in a method offorming a multilayer wiring pattern, according to an embodiment of theinvention.

FIG. 3 is a cross sectional view showing a second step in the method offorming a multilayer wiring pattern, according to the embodiment of theinvention.

FIG. 4 is a cross sectional view showing a third step in the method offorming a multilayer wiring pattern, according to the embodiment of theinvention.

FIG. 5 is a cross sectional view showing a fourth step in the method offorming a multilayer wiring pattern, according to the embodiment of theinvention.

FIG. 6 is a cross sectional view showing a fifth step in the method offorming a multilayer wiring pattern, according to the embodiment of theinvention.

FIG. 7 is a cross sectional view showing a sixth step in the method offorming a multilayer wiring pattern, according to the embodiment of theinvention.

FIG. 8 is a cross sectional view showing a seventh step in the method offorming a multilayer wiring pattern, according to the embodiment of theinvention.

FIGS. 9( a)–9(c) are views showing a configuration of a multilayerwiring board according to an embodiment of the invention, 9(a) being afront view showing a substrate (main substrate), 9(b) being a front viewshowing a provisional substrate, on which wirings constituting a firstlayer are formed, and 9(c) being a front view showing an insulating filmconstituting the first layer.

FIGS. 10( a) and 10(b) are views showing a configuration of a multilayerwiring board according to an embodiment of the invention, 10(a) being afront view showing a first layer with the insulating film of FIG. 9( c)bonded to the provisional substrate of FIGS. 9( b), and 10(b) being afront view showing a state, in which the first layer is bonded to thesubstrate shown in FIG. 9( a).

FIGS. 11( a) and 11(b) are views showing a configuration of a multilayerwiring board according to an embodiment of the invention, 11(a) being afront view showing a provisional substrate, on which wiringsconstituting a second layer are formed, and 11(b) being a front viewshowing an insulating film constituting the second layer.

FIGS. 12( a) and 12(b) are views showing a configuration of a multilayerwiring board according to an embodiment of the invention, 12(a) being afront view showing a second layer with the insulating film of FIG. 11(b) bonded to the provisional substrate of FIG. 11( a), and 12(b) being afront view showing a state, in which the second layer is bonded to thefirst layer shown in FIG. 10( b).

FIG. 13 is a perspective view showing a non-contact type card mediumcomprising a monolayered wiring pattern with a circuit elementinterposed between a main substrate and a first layer according to anembodiment of the invention.

DETAILED DESCRIPTION

An explanation will be given below to a method of manufacturing adevice, according to the invention, and embodiments of a device, anon-contact type card medium, and an electronic equipment with referenceto the drawings.

In addition, a droplet discharge method referred to in the invention isone, in which liquid droplets are discharged into a desired region toform a desired pattern including a substance being discharged, and themethod is in some cases called an ink jet method. In this case, however,discharged liquid droplets do not correspond to so-called ink used inprinting but comprise a liquid body containing a material constituting adevice, the material containing, for example, a conductive substanceconstituting a device, or a substance capable of functioning as aninsulating substance. Further, droplet discharging is not limited toatomizing at the time of discharging but includes the case wheredroplets of a liquid body are continuously (successively) dischargeddrop by drop.

FIG. 1 is a cross sectional view showing part of a multilayer wiringpattern according to an embodiment. In the figure, the reference numeral1 denotes a substrate, 2A terminals, 2B1, 2B2 and 2B3 wirings, 3B1, 3B2and 3B3 adhesive layers, 4B1, 4B2 and 4B3 insulating layers (adhesivematerial), and P12, P23, P3 through-holes. The substrate 1 is asubstrate made of, for example, glass.

The terminals 2A are made of a conductive material to make specificwirings constituting a part of wirings, which are embedded in thesubstrate 1 by processing the substrate 1. The wirings 2B1 among therespective wirings 2B1, 2B2 and 2B3 together with the adhesive layer 3B1and the insulating layer 4B1 constitute a first layer, the wirings 2B1being bonded to the insulating layer 4B1 by the adhesive layer 3B1 andconnected to the terminals 2A and the through-holes P12 in the substrate1. The wirings 2B2 together with the adhesive layer 3B2 and theinsulating layer 4B2 constitute a second layer, the wirings 2B2 beingbonded to the insulating layer 4B2 by the adhesive layer 3B2 andconnected to the through-holes P12 and the through-hole P23. The wirings2B3 together with the adhesive layer 3B3 and the insulating layer 4B3constitute a third layer, the wirings 2B3 being bonded to the insulatinglayer 4B3 by the adhesive layer 3B3 and connected to the through-holeP23 and the through-hole P3.

The adhesive layer 3B1 among the respective adhesive layers 3B1, 3B2 and3B3 is provided on a lower surface of the insulating layer 4B1 to bondthe insulating layer 4B1 to the terminals 2A, the wirings 2B1, and thesubstrate 1. The adhesive layer 3B2 is provided on a lower surface ofthe insulating layer 4B2 to bond the insulating layer 4B2 to the wirings2B2 and the insulating layer 4B1 of the first layer. The adhesive layer3B3 is provided on a lower surface of the insulating layer 4B3 to bondthe insulating layer 4B3 to the wirings 2B3 and the insulating layer 4B2of the second layer.

The respective insulating layers 4B1, 4B2 and 4B3 are formed from, forexample, polyimide, the insulating layer 4B1 being provided to ensureelectric insulation between the first layer and the second layer, theinsulating layer 4B2 being provided to ensure electric insulationbetween the second layer and the third layer, and the insulating layer4B3 being provided to ensure electric insulation between the third layerand a fourth layer, illustration of which is omitted. In addition, inFIG. 1 the respective adhesive layers 3B1, 3B2 and 3B3 and therespective wirings 2B1, 2B2 and 2B3 are exaggeratedly depicted inthickness relative to the respective insulating layers 4B1, 4B2 and 4B3for the sake of convenience. An actual thickness of the respectiveinsulating layers 4B1, 4B2 and 4B3 is fairly larger than that of therespective adhesive layers 3B1, 3B2 and 3B3 and the respective wirings2B1, 2B2 and 2B3.

The through-holes P12 among the respective through-holes P12, P23, P3are formed in a state, in which they extend through the insulating layer4B1 of the first layer in a vertical direction, thus connecting thewirings 2B1 of the first layer and the wirings 2B2 of the second layertogether. The through-hole P23 is formed in a state, in which it extendsthrough the insulating layer 4B2 of the second layer in the verticaldirection, thus connecting the wirings 2B2 of the second layer and thewirings 2B3 of the third layer together. The through-hole P3 is formedin a state, in which it extends through the insulating layer 4B3 of thethird layer in the vertical direction, thus connecting the wirings 2B3of the third layer and the wiring of the fourth layer together.

Thus the multilayer wiring pattern is formed in a state to provide amultilayered structure on the substrate 1 and featured in such astructure that the terminals 2A and the respective wirings 2B1, 2B2 and2B3 are placed in a desired state of connection by positioning of therespective layers and bonded in a multilayered manner by the respectiveadhesive layers 3B1, 3B2 and 3B3.

In addition, of course, a wiring pattern may be constituted by amonolayer, that is, only the first layer and the substrate 1 instead ofa multilayer. In this case, since there is no need of forming thethrough-holes P12 through the insulating layer 4B1 of the first layer,there is used an insulating layer 4B1 in a completely flat shape, inwhich through-holes are not provided for formation of the through-holesP12. Also, a desired wiring pattern may be formed from a substratewithout the terminals 2A, that is, a substrate with only the wirings 2B1of the first layer.

Further, it is conceivable that a chip-shaped circuit element beinterposed between the substrate 1 and the first layer. In this case, itis necessary to position the circuit element so that joining terminalsof the circuit element are connected to the terminals 2A of thesubstrate 1 or the wirings 2B1 of the first layer.

Subsequently, a method of forming the multilayer wiring pattern will bedescribed in detail with reference to FIGS. 2 to 8. In addition, FIGS. 2to 8 are process drawings showing respective steps including first toseventh steps in the method of forming the multilayer wiring pattern.

In the first step, a conductive liquid L, for example, a liquidcontaining fine silver particles being a metal is discharged by theinkjet system through an ink jet head H onto a provisional substrate 5,which is provided by first depositing a peel film 5 b on a surface of aflat-shaped backing material 5 a as shown in FIG. 2. The peel film 5 bpossesses a repellent property of a desired level. And the conductiveliquid L adhering to the peel film 5 b of the provisional substrate 5 ina pattern is subjected to heat treatment (baking treatment) in atemperature environment of around 300° C. to make the wirings 2B1(silver wiring) of the first layer (second step) as shown in FIG. 3.

When the wirings 2B1 are thus formed on the provisional substrate 5(more particularly, directly on the peel film 5 b), through-holes 4 afor the through-holes P12 are first formed as shown in FIG. 4 and aninsulating film provided on an underside thereof with the adhesive layer3B1 is bonded to the wirings 2B1 (third step). In this case, theinsulating film constitutes the insulating layer 4B1, the insulatingfilm being positioned so that the through-holes 4 a are disposed justabove the predetermined wirings 2B1, and bonded to the wirings 2B1 and apart (portion, in which the wirings 2B1 are absent) of the peel film 5 bby the adhesive layer 3B1.

In this state, the provisional substrate 5 together with the peel film 5b is peeled off to be removed (fourth step) as shown in FIG. 5. Sincethe peel film 5 b possesses a favorable repellent property, it isexcellent in peel property and so is easily peeled off from the adhesivelayer 3B1. And in place of the provisional substrate 5, a mainsubstrate, that is, the substrate 1 is bonded to the insulating filmwith the adhesive layer 3B1 therebetween as shown in FIG. 6 (fifthstep). When the fifth step is completed, formation of the first layer onthe substrate 1 is completed.

With such way of forming the first layer, instead of discharging theconductive liquid L directly on the substrate 1 to form the wirings 2B1,the conductive liquid L is discharged directly on the provisionalsubstrate 5 (more particularly, the peel film 5 b), on which a repellentproperty of a desired level is ensured, to form the wirings 2B1, andthen bonded to the substrate 1, so that the wirings 2B1 having beenformed on the basis of the ink jet system can be arranged on thesubstrate 1 irrespective of a material of the substrate 1, that is, arepellent property of the substrate 1.

When the first layer is thus formed, the ink jet head H has theconductive liquid L discharged toward areas of the peripheral edges ofthe through-holes 4 a (sixth step) as shown in FIG. 7. As a result,surface tension acts to adhere the conductive liquid L to the wirings2B1, the peripheral edges and areas of the upper ends of thethrough-holes 4 a in a bridge-like manner as shown in the figure. In thesame manner as in the second step, the through-holes P12 (silverthrough-holes) shown in FIG. 8 are then formed by subjecting theconductive liquid L to heat treatment (baking treatment) in atemperature environment of around 300° C. (seventh step). Further, byrepeating the above respective steps, upper layers, that is, the secondlayer, the third layer, . . . and the through-holes P23, P3, . . .connecting the respective layers together are formed, and finally themultilayer wiring pattern shown in FIG. 1 is finished.

Further, configurations of multilayer wiring boards manufactured on thebasis of the method of forming a multilayer wiring pattern will bedescribed particularly with reference to front views shown in FIGS. 9 to12. In addition, the multilayer wiring boards are two-layered boardscomposed of the substrate 1, the first layer, and the second layer, andan explanation will be given to structures of respective constituentscorresponding to the above description.

FIG. 9 is a front view showing the provisional substrate 5 and theinsulating film (the insulating layer 4B1), which constitute the firstlayer, and a structure of the substrate 1. In FIG. 9, (a) is a frontview showing the substrate 1 (main substrate), (b) is a front viewshowing the provisional substrate 5 in a state, in which the wirings 2B1of the first layer are formed, and (c) is a front view showing theinsulating film (the insulating layer 4B1) of the first layer.

As shown in FIG. 9( a), the terminals 2A are first embedded in the mainsubstrate 1 to be formed. Also, the wirings 2B1 are formed as linepatterns, which assume predetermined shapes and are arranged inpredetermined positions, on the provisional substrate 5 by the ink jetsystem as shown in FIG. 9( b), while a plurality of through-holes 4 afor formation of the through-holes P12 are arranged in predeterminedpositions and a terminal opening 4 b for exposing the terminals 2A isformed centrally of the insulating layer 4B1 as shown in FIG. 9( c). Inaddition, the main substrate 1, the provisional substrate 5, and theinsulating film 4B1 are set to assume a square-shaped outward form andtheir outward forms are set such that the provisional substrate 5 andthe insulating layer 4B1 are of the same size and the main substrate 1is somewhat larger than the provisional substrate 5 and the insulatinglayer 4B1.

Also, in FIG. 10, (a) is a front view showing a state, in which theinsulating layer 4B1 is overlapped on the provisional substrate 5 to bebonded thereto, and (b) is a front view showing a state, in which theinsulating layer bonded to the provisional substrate 5 is bonded to thesubstrate 1, that is, a state, in which the first layer is formed on thesubstrate 1.

The provisional substrate 5 and the insulating layer 4B1, which assumethe same outward form, are overlapped on each other in a state, in whichthey are positioned relative to each other, and adhered to each other bythe adhesive layer 3B1 provided on an underside of the insulating layer4B1 as shown in FIG. 10( a). In this state, the respective through-holes4 a are positioned just above the predetermined wirings 2B1. And suchinsulating layer 4B1 is positioned relative to and bonded to the mainsubstrate 1 as shown in FIG. 10( b) in a state, in which the provisionalsubstrate 5 is removed, that is, only the wirings 2B1 are bonded to theinsulating layer 4B1. In this state, the respective terminals 2A on themain substrate 1 contact with the predetermined wirings 2B1 in apartially overlapping state and the remaining portions of the terminalsare exposed outside the terminal opening 4 b.

Subsequently, FIG. 11 is a front view showing structures of theprovisional substrate 5 and an insulating film (insulating layer 4B2),which constitute a second layer. In FIG. 11, (a) is a front view showingthe provisional substrate 5 in a state, in which wirings 2B2 of thesecond layer are formed, and (b) is a front view showing the insulatingfilm (insulating layer 4B2) of the second layer. As shown in FIG. 11(a), the wirings 2B2 for connecting the wirings 2B1 of the first layer toone another are formed as line patterns, which assume predeterminedshapes and are arranged in predetermined positions, on the provisionalsubstrate 5 by means of the ink jet system.

Also, a plurality of through-holes 4 a for formation of thethrough-holes P23 are arranged in predetermined positions in theinsulating layer 4B2 and a terminal opening 4 b for exposing theterminals 2A on the main substrate 1 is formed centrally of theinsulating layer 4B2 as shown in FIG. 11( b). Like the provisionalsubstrate 5 and the insulating layer 4B1, which constitute the firstlayer, the provisional substrate 5 and the insulating layer 4B2 are setto assume a square-shaped outward form and are of the same size inoutward form.

When the insulating layer 4B2 is positioned on the provisional substrate5 to be overlapped on and bonded to the provisional substrate, therespective through-holes 4 a are positioned in predetermined positionson the wirings 2B2 as shown in FIG. 12( a). And when the ink jet systemis used to form through-holes P12 in the respective through-holes 4 a onthe first layer shown in FIG. 10( a) and the insulating layer 4B2 ispositioned to be bonded, a two-layered wiring board is finished as shownin FIG. 12( b). In the two-layered wiring board, the wirings 2B1 of thefirst layer are connected to the predetermined wirings 2B2 of the secondlayer through the through-holes P12, and thus a desired circuit isformed by the wirings 2B1 of the first layer and the wirings 2B2 of thesecond layer, which are connected to each other. And various signals andelectric power are supplied from the outside through, for example,contact pins, or the like, to the respective terminals 2A, which areexposed outside the terminal opening 4 b.

Subsequently, FIG. 13 is a perspective view showing an exampleconfiguration of a non-contact type card medium comprising a monolayeredwiring board with a chip circuit element (IC chip 7) interposed betweena substrate 1 (main substrate) and a first layer. Two wirings 2B1 arebonded to an underside of an insulating layer 4B1. One of the wirings2B1 is set to assume a shape of an open loop to constitute a loopantenna as shown in the figure, and the other of the wirings 2B1 is setto assume a substantially straight shape. Meanwhile, two terminals 2Aare formed by providing a wiring in a predetermined position on thesubstrate 1 and arranging an insulating film 6 on the wiring, and the ICchip 7 in the form of a bare chip is bonded and fixed in thepredetermined position. Externally connected terminals 7 a, 7 b areprovided on an upper surface of the IC chip 7.

When the insulating layer 4B1 is positioned on the thus configuredsubstrate 1 to be bonded thereto, the substantially straight wiring 2B1has its end thereof overlapping and connecting to the externallyconnected terminal 7 a and its other end overlapping and connecting toone of the terminals 2A as shown in the figure. Also, the open-loopwiring 2B1 has its one end overlapping and connecting to the externallyconnected terminal 7 b and its other end overlapping and connecting tothe other of the terminals 2A. That is, the IC chip 7 is connected bythe respective wirings 2B1, so that a non-contact type card mediumincluding a loop antenna circuit is formed. At least one ofelectromagnetic waves and static capacity coupling performs at least oneof electricity supply and data transfer between the non-contact typecard medium and an external transmitting and receiving apparatus (notshown).

As described above, the invention comprises the steps of forming wiringsby application of heat treatment after the ink jet system is used todischarge a conductive liquid onto a provisional substrate having apredetermined repellent property, bonding an insulating film to thewirings with an adhesive material therebetween, peeling and removing theprovisional substrate, and bonding and fixing the wirings together withthe insulating film on a main substrate by an adhesive material, so thatthe ink jet system can be used to form favorable wirings irrespective ofa quality of a substrate material. That is, instead of discharging aconductive liquid directly onto that main substrate, on which wiringsare to be actually formed, to form a wiring pattern as in a conventionalart with the use of the ink jet system, a conductive liquid isdischarged onto a provisional substrate, which ensures a repellentproperty of a certain level, to previously form wirings and the wiringstogether with an insulating film are bonded and fixed to a mainsubstrate by an adhesive material, so that there is no need ofsubjecting the main substrate to surface preparation to impart arepellent property of a certain level to the main substrate and so theforming step of multilayer wirings with the use of the ink jet systemcan be simplified correspondingly.

The entire disclosure of Japanese Patent Application No. 2002-119447filed Apr. 22, 2002 is incorporated by reference.

1. A method of manufacturing a device, comprising the steps of: (a)forming first wirings on a provisional substrate; (b) mounting aninsulating body on the first wirings to form a laminated body of thefirst wirings and the insulating body, the insulating body having anadhesive layer and an insulating layer; (c) peeling off the laminatedbody from the provisional substrate; and (d) mounting the laminated bodyon a main substrate, wherein openings are formed in the insulating bodyto expose at least a part of the first wirings, and further comprising,after the step (d), (e) forming a conductive layer in the openings. 2.The method of manufacturing a device, according to claim 1, wherein inthe step (a), before the first wirings are formed, a surface of theprovisional substrate is made to possess a property permitting the firstwirings and the provisional substrate to peel off in the step (c). 3.The method of manufacturing a device, according to claim 2, wherein theproperty permitting the first wirings and the provisional substrate topeel off comprises a repellent property.
 4. The method of manufacturinga device, according to claim 1, wherein in the step (a), the firstwirings are formed by means of a droplet discharge method.
 5. The methodof manufacturing a device, according to claim 1, wherein the step (b)comprises bonding the insulating body to the first wirings.
 6. Themethod of manufacturing a device, according to claim 1, wherein in thestep (d), second wirings are first formed on the main substrate, and thelaminated body is mounted on the main substrate in a manner to provideconduction between the second wirings and the first wirings.
 7. Themethod of manufacturing a device, according to claim 1, wherein in thestep (d), circuit terminals are first formed on the main substrate, andthe laminated body is mounted on the main substrate in a manner toprovide conduction between the circuit terminals and the first wirings.8. The method of manufacturing a device, according to claim 1, whereinthe openings are first formed on the insulating body prior to the step(b).
 9. The method of manufacturing a device, according to claim 1,wherein the step (e) further comprises a droplet discharge method. 10.The method of manufacturing a device, according to claim 9, wherein thedroplets comprise liquid bodies containing fine metallic particles. 11.The method of manufacturing a device, according to claim 1, whereinmultilayer wirings are formed by forming at least one or more newlaminated bodies on the laminated body which is performed in the samestep as that in which the laminated body is formed,.